External Flipping Unit
YFL Series
As part of the semiconductors manufacturing process, in some cases, there is a need to flip the semiconductor substrates.
Yaskawa offers an optimal solution of an external flipping unit with high performance and flexibility.
Technical features:
Wafer & Substrate Size – 200 mm／300mm／200mm Ring／300mm Ring *1 (all or any of these sizes)
Wafer Material – Silicon, Glass
Wafer Detection – Optical sensor
Wafer Alignment Acknowledge – Less than 3 sec
Rotation Range – 0°-180° (no intermediate stop)
Clean Class – ISO Class 2
Wafer Holding Method – edge or vacuum grip
Detection of Rotation Position – Magnetic sensor
CDA Requirement – 0.5 MPa
Power Supply – VDC24
Approx. mass – 17kg
