ELECTRONIC PACKAGING, ELECTRO–MECHANICAL SOLUTIONS

The annual event will deal with providing various solutions for electronic system packaging, innovations and solutions for connecting mother boards, environmentally friendly innovations and solutions for server farm racks, packaging for vehicles, commercial packaging, racks and cabins for communication applications and for special environmental conditions and more.

Admission to the conference and to the trade fair is free of charge; nevertheless, registration in advance is required. Click here for registration